Sony Quietly Fixes Liquid Metal Cooling Issue in Latest PS5 Slim Revision
Owners of earlier PlayStation 5 models have long reported problems with liquid metal thermal interface material (TIM) seeping out of its intended area, occasionally leading to overheating of the console’s AMD chipset. In a surprising move, Sony has now addressed the issue, though only in the latest hardware revisions of the PS5 Slim.
Silent Hardware Update Discovered on the PS5 Slim
Polish YouTuber and PlayStation modder Modyfikator recently revealed the change after tearing down brand-new PS5 Slim units. According to their findings:
- The PlayStation 5 Slim (model CFI-2116), both Disc and Digital Editions, now feature an all-new cooling system.
- This update is described as “the most important hardware update of the year,” ensuring improved stability and reliability.
- Comparative teardowns show redesigned internals that prevent liquid metal leakage and optimize heat dissipation.
Earlier in 2025, Sony implemented similar improvements in the PlayStation 5 Pro, following complaints about unstable factory applications of liquid metal TIM. The redesigned internals were engineered to prevent leaks around the APU.
Now, these cooling upgrades have extended to the cheaper PS5 Slim SKU, giving mainstream buyers the same reliability benefits once reserved for the premium model.
Modyfikator highlighted the benefits of the update:
- No more concerns about thermal degradation compared to older PS5 revisions.
- The new Slim units are considered the most stable PlayStation 5 consoles available today.
- Optimized heatsink cores deliver maximum heat dissipation while maintaining long-term reliability.
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